Detail
| PLC Splitter Wafers |
Based on Planar Lightwave Circuit technologies, PLC splitter wafers are produced on the quartz substrate through a series of processes including CVD deposition, photo-masking,etching,etc.PLC splitter wafers can be designed for 1×2, 1×4, 1×8, 1×16, 1×32, 1×64, and 2×N.Splitter chips with high yield,quality,and reliability are made of PLC wafers through dicing and polishing. | |
| Key Features |
| 6 inches round quartz wafer |
| Low insertion loss ＆ low PDL |
| Excellent channel-to-channel uniformity |
| Wide operating wavelength:1260nm-1550nm |
| RoHS compliance |
| Applications |
| Optical communication networks,Telecom equipment,Three-Network-Integration systems,Including Signal/power distribution,Fiber-To-The-Home(FTTH),Passive Optical Network (PON). | |
| Optical Specifications | |||||||
| Parameter | Rate | Unit | 1x2 | 1x4 | 1x8 | 1x16 | 1x32 | 1x64 |
Operating wavelength | nm | 1260-1650 | ||||||
| Insertion loss | P | dB | 3.60 | 6.70 | 9.80 | 13.20 | 16.20 | 19.80 |
| PDL | P | dB | 0.15 | 0.15 | 0.20 | 0.25 | 0.25 | 0.30 |
| Uniformity | P | dB | 0.50 | 0.50 | 0.60 | 0.80 | 1.00 | 1.20 |
| Return Loss | dB | ≥55 | ||||||
| Directivity | dB | ≥55 | ||||||
Operating Temperature | ℃ | -40~+85 | ||||||
Storage Temperature | ℃ | -40~+85 | ||||||
| Wafer Specifications | |||||||
| No. | Description | Specification | ||||||
| 1 | Diameter | 6inch(150±0.5mm) | ||||||
| 2 | Directional flat | 47.5mm | ||||||
| 3 | Flatness | <500um | ||||||
| 4 | Material | Quartz | ||||||
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